Patent Assignment
Reel/Frame 032646/0721
Assignment of Assignor's Interest
Recorded: 2014-04-10
Pages: 6
Assignors
NISHIO, JOHJI
Executed: 2014-02-13
SHIMIZU, TATSUO
Executed: 2014-02-14
OTA, CHIHARU
Executed: 2014-03-31
SHINOHE, TAKASHI
Executed: 2014-02-14
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Sic Epitaxial Wafer and Semiconductor Device