Patent Assignment
Reel/Frame 032661/0058
Assignment of Assignor's Interest
Recorded: 2014-04-11
Pages: 3
Assignors
HUANG, YU-LUNG
Executed: 2014-04-09
CHANG, SHU-MING
Executed: 2014-04-09
LIU, TSANG-YU
Executed: 2014-04-09
HO, YEN-SHIH
Executed: 2014-04-09
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI CITY, TAOYUAN COUNTY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Fabricating the Same