IP Library › Assignment 032667/0454
Patent Assignment
Reel/Frame 032667/0454

Assignment of Assignor's Interest

Recorded: 2014-04-14 Pages: 4
Assignors
LIBBERT, JEFFREY L.
Executed: 2013-03-04
RIES, MICHAEL JOHN
Executed: 2013-03-04
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property (1)
Method for Low Temperature Layer Transfer in the Preparation of Multilayer Semiconductor Devices
Patent: 9,281,233 →
Application: 14/133,893 →
Publication: US 2014/0187020
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 032963/0522 →
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →