Patent Assignment
Reel/Frame 032963/0522
Assignment of Assignor's Interest
Recorded: 2014-05-27
Pages: 7
Assignor
MEMC ELECTRONIC MATERIALS, INC.
Executed: 2014-05-23
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01 STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Properties
(13)
Gas Distribution Manifold System for Chemical Vapor Deposition Reactors and Method of Use
Application:
13/767,393 →
Publication:
US 2014/0224175
Systems and Methods for Reducing Dust in Granular Material
Single Side Polishing Using Shape Matching
Production of High Precipitate Density Wafers by Activation of Inactive Oxygen Precipitate Nuclei
Double Side Polisher with Platen Parallelism Control
Method for Low Temperature Layer Transfer in the Preparation of Multilayer Semiconductor Devices
Dopant Funnel for Loading and Dispensing Dopant
Application:
14/134,830 →
Publication:
US 2014/0174591
Method and System for Full Resolution Real-Time Data Logging
Method and System for a Meta-Recipe Control Software Architecture
Protective Coating to Prevent Reaction Between Graphite Susceptor and Quartz Crucible
Application:
14/141,101 →
Publication:
US 2014/0182511
Methods and Systems for Deterministic and Multithreaded Script Objects and Script Engine
Methods and Systems for Preventing Unsafe Operations
Liner Assemblies for Substrate Processing Systems
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 14, 2014
From: LIBBERT, JEFFREY L.; RIES, MICHAEL JOHN
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032667/0454 →
Assignment of Assignor's Interest
Apr 16, 2014
From: ALBRECHT, PETER D.; BHAGAVAT, SUMEET S.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032683/0211 →
Assignment of Assignor's Interest
Apr 16, 2014
From: ORSCHEL, BENNO
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032683/0567 →
Assignment of Assignor's Interest
Apr 23, 2014
From: ORSCHEL, BENNO; WOLFRAM, MIKE
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032734/0688 →
Assignment of Assignor's Interest
Apr 23, 2014
From: HILKER, JOHN DAVID; KIMBEL, STEVEN L.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032734/0825 →
Assignment of Assignor's Interest
Apr 23, 2014
From: RATHOD, SHAILENDRA B.; PHILLIPS, RICHARD J.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032734/0955 →
Assignment of Assignor's Interest
Apr 23, 2014
From: YUN, SEOK-MIN; PARK, SEONG-SU; KIM, SE-MYUNG; CHOI, WON-JIN
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032735/0111 →
Assignment of Assignor's Interest
Apr 23, 2014
From: ABEDIJABERI, ARASH; THOMAS, SHAWN
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032735/0220 →
Assignment of Assignor's Interest
Apr 23, 2014
From: ABEDIJABERI, ARASH
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032735/0262 →
Assignment of Assignor's Interest
Apr 23, 2014
From: BHAGAVAT, SUMEET S.; LOW, KHIAM HOW; YOSHIMURA, ICHIRO; PITNEY, JOHN A.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032737/0672 →
Assignment of Assignor's Interest
Apr 23, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; CORNARA, MARCO; GAMBARO, DANIELA
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032738/0465 →
Assignment of Assignor's Interest
Apr 23, 2014
From: ORSCHEL, BENNO; WOLFRAM, MIKE
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032734/0414 →
Assignment of Assignor's Interest
Apr 23, 2014
From: ORSCHEL, BENNO; WOLFRAM, MIKE
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032734/0594 →
Assignment of Assignor's Interest
Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →