IP Library Assignment 032685/0023
Patent Assignment
Reel/Frame 032685/0023

Assignment of Assignor's Interest

Recorded: 2014-04-16 Pages: 6
Assignors
WU, HSIAO-CHIA
Executed: 2014-04-11
FANG, SHILIN
Executed: 2014-04-11
LO, TSE-HUANG
Executed: 2014-04-11
CHEN, ZHENGPEI
Executed: 2014-04-11
ZHANG, SHU
Executed: 2014-04-11
Assignee
CSMC TECHNOLOGIES FAB1 CO., LTD.
NO. 5, HANJIANG ROAD, WUXI NEW DISTRICT WUXI, JIANGSU, 214028, CHINA
Covered Property (1)
Method for Manufacturing Semiconductor Thick Metal Structure
Patent: 8,956,972 →
Application: 14/351,828 →
Publication: US 2014/0329385
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Apr 30, 2019
From: CSMC TECHNOLOGIES FAB2 CO., LTD.; CSMC TECHNOLOGIES FAB1 CO., LTD.
To: CSMC TECHNOLOGIES FAB2 CO., LTD.
Reel/Frame 049041/0248 →