IP Library › Assignment 032711/0004
Patent Assignment
Reel/Frame 032711/0004

Assignment of Assignor's Interest

Recorded: 2014-04-18 Pages: 3
Assignors
LIU, KAI
Executed: 2014-01-10
LIN, CHAO-KUN
Executed: 2014-01-10
Assignee
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
9740 IRVINE BOULEVARD, SUITE D700, IRVINE, CALIFORNIA, 92618
Covered Property (1)
High Efficiency Light Emitting Diode Package Suitable for Wafer Level Packaging
Patent: 9,318,671 →
Application: 14/256,715 →
Publication: US 2015/0303359
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 18, 2014
From: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
To: TOSHIBA CORPORATION
Reel/Frame 032711/0030 →
Assignment of Assignor's Interest Jan 24, 2020
From: TOSHIBA CORPORATION
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051604/0824 →
Assignment of Assignor's Interest Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →