IP Library › Assignment 032711/0030
Patent Assignment
Reel/Frame 032711/0030

Assignment of Assignor's Interest

Recorded: 2014-04-18 Pages: 3
Assignor
Assignee
TOSHIBA CORPORATION
1-1, SHIBAURA, 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
High Efficiency Light Emitting Diode Package Suitable for Wafer Level Packaging
Patent: 9,318,671 →
Application: 14/256,715 →
Publication: US 2015/0303359
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 18, 2014
From: LIU, KAI; LIN, CHAO-KUN
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 032711/0004 →
Assignment of Assignor's Interest Jan 24, 2020
From: TOSHIBA CORPORATION
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051604/0824 →
Assignment of Assignor's Interest Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →