IP Library Assignment 032840/0891
Patent Assignment
Reel/Frame 032840/0891

Assignment of Assignor's Interest

Recorded: 2014-05-07 Pages: 4
Assignors
OOTORII, HIIZU
Executed: 2014-04-24
ADACHI, KIWAMU
Executed: 2014-04-25
MIZUNO, TAKESHI
Executed: 2014-04-30
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property (1)
Method of Manufacturing Mounting Substrate and Method of Manufacturing Electronic Apparatus
Application: 14/270,762 →
Publication: US 2014/0339289
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039189/0797 →