Patent Assignment
Reel/Frame 032857/0956
Assignment of Assignor's Interest
Recorded: 2014-05-09
Pages: 4
Assignee
MICRO PROCESSING TECHNOLOGY, INC.
3446 GOLDEN GATE WAY, LAFAYETTE, CALIFORNIA, 94549
Covered Property
(1)
Method Using Fluid Pressure to Remove Back Metal from Semiconductor Wafer Scribe Streets
Patent:
8,906,745 →
Application:
14/273,755 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 21, 2017
From: MICRO PROCESSING TECHNOLOGY, INC.
To: MICRO PROCESSING TECHNOLOGY, INC.; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044194/0630 →
Assignment of Assignor's Interest
Nov 21, 2017
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044194/0661 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →