Patent Assignment
Reel/Frame 044194/0661
Assignment of Assignor's Interest
Recorded: 2017-11-21
Pages: 2
Assignor
GRIVNA, GORDON M.
Executed: 2017-11-20
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method Using Fluid Pressure to Remove Back Metal from Semiconductor Wafer Scribe Streets
Patent:
8,906,745 →
Application:
14/273,755 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 9, 2014
From: LINDSEY, PAUL C., JR; FOOTE, DARRELL
To: MICRO PROCESSING TECHNOLOGY, INC.
Reel/Frame 032857/0956 →
Assignment of Assignor's Interest
Nov 21, 2017
From: MICRO PROCESSING TECHNOLOGY, INC.
To: MICRO PROCESSING TECHNOLOGY, INC.; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044194/0630 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →