Patent Assignment
Reel/Frame 032861/0085
Assignment of Assignor's Interest
Recorded: 2014-05-09
Pages: 5
Assignors
PARK, SEONG WON
Executed: 2014-05-07
LEE, HUN TEAK
Executed: 2014-05-02
BEAK, WOONJAE
Executed: 2014-05-07
KIM, MINJUNG
Executed: 2014-05-02
KIM, CHANGHWAN
Executed: 2014-05-02
KWAK, BYUNGHYUN
Executed: 2014-05-07
KIM, GWANGTAE
Executed: 2014-05-07
LEE, HEESOO
Executed: 2014-05-07
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Plated Copper Posts and Method of Manufacture Thereof
Patent:
9,693,455 →
Application:
14/227,346 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.