IP Library › Assignment 032924/0765
Patent Assignment
Reel/Frame 032924/0765

Assignment of Assignor's Interest

Recorded: 2014-05-19 Pages: 4
Assignor
KADAU, KAI
Executed: 2014-05-07
Assignee
SIEMENS AKTIENGESELLSCHAFT
WITTELSBACHERPLATZ 2, MUNICH, 80333, GERMANY
Covered Properties (2)
Probabilistic Modeling and Sizing of Embedded Flaws in Ultrasonic Nondestructive Inspections for Fatigue Damage Prognostics and Structural Integrity Assessment
Patent: 9,792,555 →
Application: 14/106,919 →
Publication: US 2014/0229149
Probabilistic Modeling and Quantification of Embedded Flaws in Ultrasonic Non-destructive Inspection and its Application
Application: 61/748,846 →
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 23, 2014
From: GUO, YAN; RASSELKORDE, EL MAHJOUB; ABBASI, WAHEED A.; LEE, CHIN-SHENG
To: SIEMENS ENERGY, INC.
Reel/Frame 033373/0127 →
Assignment of Assignor's Interest Jul 28, 2014
From: GUAN, XUEFEI; ZHANG, JINGDAN; ZHOU, SHAOHUA KEVIN
To: SIEMENS CORPORATION
Reel/Frame 033399/0334 →
Assignment of Assignor's Interest Sep 19, 2017
From: SIEMENS CORPORATION
To: SIEMENS ENERGY, INC.
Reel/Frame 043629/0354 →