IP Library › Assignment 033399/0334
Patent Assignment
Reel/Frame 033399/0334

Assignment of Assignor's Interest

Recorded: 2014-07-28 Pages: 6
Assignors
GUAN, XUEFEI
Executed: 2014-05-08
ZHANG, JINGDAN
Executed: 2014-05-07
ZHOU, SHAOHUA KEVIN
Executed: 2014-07-01
Assignee
SIEMENS CORPORATION
170 WOOD AVENUE SOUTH, IPD, ISELIN, NEW JERSEY, 08830
Covered Properties (2)
Probabilistic Modeling and Sizing of Embedded Flaws in Ultrasonic Nondestructive Inspections for Fatigue Damage Prognostics and Structural Integrity Assessment
Patent: 9,792,555 →
Application: 14/106,919 →
Publication: US 2014/0229149
Probabilistic Modeling and Quantification of Embedded Flaws in Ultrasonic Non-destructive Inspection and its Application
Application: 61/748,846 →
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 19, 2014
From: KADAU, KAI
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 032924/0765 →
Assignment of Assignor's Interest Jul 23, 2014
From: GUO, YAN; RASSELKORDE, EL MAHJOUB; ABBASI, WAHEED A.; LEE, CHIN-SHENG
To: SIEMENS ENERGY, INC.
Reel/Frame 033373/0127 →
Assignment of Assignor's Interest Sep 19, 2017
From: SIEMENS CORPORATION
To: SIEMENS ENERGY, INC.
Reel/Frame 043629/0354 →