Patent Assignment
Reel/Frame 032957/0737
Assignment of Assignor's Interest
Recorded: 2014-05-23
Pages: 5
Assignors
SAKUMA, JUN
Executed: 2014-05-23
MATSUMURA, HIDEAKI
Executed: 2014-05-23
OSHIMA, TADASHI
Executed: 2014-05-23
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Device Having Moisture-Resistant Rings Being Formed in a Peripheral Region.
Application:
14/286,253 →
Publication:
US 2014/0273453
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 3RD Assignor's Name Previously Recorded on Reel 032957 Frame 0737. Assignor(S) Hereby Confirms the Correct Assignor's Name as Follows: Ohshima, Tadashi.
Aug 25, 2014
From: SAKUMA, JUN; MATSUMURA, HIDEAKI; OHSHIMA, TADASHI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 033648/0001 →
Assignment of Assignor's Interest
Apr 17, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035453/0904 →
Assignment of Assignor's Interest
Dec 7, 2016
From: SOCIONEXT INC.
To: MIE FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 040589/0163 →