Patent Assignment
Reel/Frame 033046/0804
Assignment of Assignor's Interest
Recorded: 2014-06-06
Pages: 5
Assignors
WU, JIUNG
Executed: 2014-04-23
LAI, KUAN-LIANG
Executed: 2014-04-23
CHUNG, MING-TSU
Executed: 2014-04-23
SHIH, HONG-YE
Executed: 2014-04-23
YANG, KU-FENG
Executed: 2014-04-23
WU, TSANG-JIUH
Executed: 2014-04-23
CHIOU, WEN-CHIH
Executed: 2014-04-23
JENG, SHIN-PUU
Executed: 2014-04-23
YU, CHEN-HUA
Executed: 2014-04-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Profile of Through Via Protrusion in 3DIC Interconnect