Assignment of Assignor's Interest

Recorded: 2014-06-09 Pages: 5

Assignors

PAEK, SUNG-KWAN

Executed: 2014-05-23

SHIN, DONG-IL

Executed: 2014-05-23

PARK, SE-CHUEL

Executed: 2014-05-23

Assignee

MDS CO., LTD.

84 JEONGDONG-RO, SEONGSAN-GU, GYEONGSANGNAM-DO, CHANGWON-SI, 642-120, KOREA, REPUBLIC OF

Covered Property (1)

Lead Frame and Semiconductor Package Manufactured by Using the Same

Patent: 9,142,495 →

Application: 14/363,854 →

Publication: US 2014/0319666

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.