IP Library Assignment 033060/0600
Patent Assignment
Reel/Frame 033060/0600

Assignment of Assignor's Interest

Recorded: 2014-06-09 Pages: 4
Assignors
MITAMURA, YOSHIMICHI
Executed: 2014-05-26
NAKATA, TAKUTO
Executed: 2014-05-26
Assignee
ASAHI KASEI E-MATERIALS CORPORATION
1-105, KANDA JINBOCHO, CHIYODA-KU, TOKYO, 101-8101, JAPAN
Covered Property (1)
Heat-Reactive Resist Material, Mold Manufacturing Method, Mold, Development Method and Pattern Formation Material
Application: 14/359,869 →
Publication: US 2014/0314898