HEAT-REACTIVE RESIST MATERIAL, MOLD MANUFACTURING METHOD, MOLD, DEVELOPMENT METHOD AND PATTERN FORMATION MATERIAL
A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol % or more less than 10.0 mol % in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a fluorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.
1 . A heat-reactive resist material containing copper oxide, and silicon or silicon oxide,
wherein a content of the silicon or the silicon oxide in the heat-reactive resist material is 4.0 mol % or more to less than 10.0 mol % in terms of mole of silicon.
2 . The heat-reactive resist material according to claim 1 , wherein the content of the silicon or the silicon oxide in the heat-reactive resist material ranges from 4.0 mol % to 8.5 mol % in terms of mole of silicon.
3 . The heat-reactive resist material according to claim 1 , wherein the content of the silicon or the silicon oxide in the heat-reactive resist material ranges from 6.5 mol % to 8.5 mol % in terms of mole of silicon.
4 . A manufacturing method for manufacturing a mold having a concavo-convex shape on a substrate surface using the heat-reactive resist material according to claim 1 , including:
a step (1) of forming a heat-reactive resist layer on the substrate using the heat-reactive resist material;
a step (2) of exposing the heat-reactive resist layer, and then, developing with a developing solution;
a step (3) of performing dry etching on the substrate with a fluorocarbon using the heat-reactive resist layer as a mask; and
a step (4) of removing the heat-reactive resist layer, wherein the developing solution is a glycine solution or a mixed solution of glycine and ammonium oxalate.
5 . The manufacturing method of the mold according to claim 4 , wherein a film thickness of the heat-reactive resist layer ranges from 10 nm to 50 nm.
6 . The manufacturing method of the mold according to claim 4 , wherein a film thickness of the heat-reactive resist layer ranges from 20 nm to 30 nm.
7 . The manufacturing method of the mold according to claim 4 , wherein the heat-reactive resist layer is formed by a method selected from among a sputtering method, a vapor deposition method and a CVD method.
8 . The manufacturing method of the mold according to claim 4 , wherein the substrate is in the shape of a plate.
9 . The manufacturing method of the mold according to claim 4 , wherein the substrate is in the shape of a sleeve.
10 . The manufacturing method of the mold according to claim 4 , wherein the substrate is quartz glass.
11 . The manufacturing method of the mold according to claim 4 , wherein exposure in the step (2) is performed using a semiconductor laser.
12 . A mold manufactured by the manufacturing method of the mold according to claim 4 .
13 . The mold according to claim 12 , wherein the mold has a fine pattern ranging from 1 nm to 1 μm.
14 . A development method for developing the heat-reactive resist material according to claim 1 , including:
a step (1) of forming a heat-reactive resist layer on a substrate using the heat-reactive resist material; and
a step (2) of exposing the heat-reactive resist layer, and then, developing with a developing solution,
wherein the developing solution is a glycine solution or a mixed solution of glycine and ammonium oxalate.
15 . A pattern formation material comprised of a combination of the heat-reactive resist material according to claim 1 , and a developing solution comprised of a glycine solution or a mixed solution of glycine and ammonium oxalate.
16 . A manufacturing method for manufacturing a mold having a concavo-convex shape on a substrate surface using the heat-reactive resist material according to claim 2 , including:
a step (1) of forming a heat-reactive resist layer on the substrate using the heat-reactive resist material;
a step (2) of exposing the heat-reactive resist layer, and then, developing with a developing solution;
a step (3) of performing dry etching on the substrate with a fluorocarbon using the heat-reactive resist layer as a mask; and
a step (4) of removing the heat-reactive resist layer, wherein the developing solution is a glycine solution or a mixed solution of glycine and ammonium oxalate.
17 . A manufacturing method for manufacturing a mold having a concavo-convex shape on a substrate surface using the heat-reactive resist material according to claim 3 , including:
a step (1) of forming a heat-reactive resist layer on the substrate using the heat-reactive resist material;
a step (2) of exposing the heat-reactive resist layer, and then, developing with a developing solution;
a step (3) of performing dry etching on the substrate with a fluorocarbon using the heat-reactive resist layer as a mask; and
a step (4) of removing the heat-reactive resist layer, wherein the developing solution is a glycine solution or a mixed solution of glycine and ammonium oxalate.
18 . The manufacturing method of the mold according to claim 5 , wherein the heat-reactive resist layer is formed by a method selected from among a sputtering method, a vapor deposition method and a CVD method.
19 . The manufacturing method of the mold according to claim 6 , wherein the heat-reactive resist layer is formed by a method selected from among a sputtering method, a vapor deposition method and a CVD method.
20 . The manufacturing method of the mold according to claim 5 , wherein the substrate is in the shape of a plate.