Patent Assignment
Reel/Frame 033106/0933
Assignment of Assignor's Interest
Recorded: 2014-06-16
Pages: 2
Assignors
KIWANAMI, TAKAYUKI
Executed: 2014-04-28
SATO, JUNJI
Executed: 2014-04-22
FUKASE, KATSUYA
Executed: 2014-04-22
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Manufacturing Method of Wiring Substrate