IP Library › Assignment 033127/0396
Patent Assignment
Reel/Frame 033127/0396

Assignment of Assignor's Interest

Recorded: 2014-06-18 Pages: 10
Assignor
Assignee
ASM TECHNOLOGY SINGAPORE PTE. LTD.
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property (1)
Method of Singulating a Thin Semiconductor Wafer
Patent: 8,785,298 →
Application: 13/796,384 →
Publication: US 2013/0244404
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 18, 2014
From: ADVANCED LASER SEPARATION INTERNATIONAL (ALSI) N.V.
To: ASM LASER SEPARATION INTERNATIONAL (ALSI) B.V.
Reel/Frame 033127/0605 →
Change of Name Nov 21, 2022
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 061975/0605 →