IP Library Assignment 033127/0605
Patent Assignment
Reel/Frame 033127/0605

Assignment of Assignor's Interest

Recorded: 2014-06-18 Pages: 11
Assignor
Assignee
ASM LASER SEPARATION INTERNATIONAL (ALSI) B.V.
PRINS BERNARDPLEIN 200, AMSTERDAM, 1097 JB, NETHERLANDS
Covered Property (1)
Method of Singulating a Thin Semiconductor Wafer
Patent: 8,785,298 →
Application: 13/796,384 →
Publication: US 2013/0244404
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 18, 2014
From: ASM LASER SEPARATION INTERNATIONAL (ALSI) B.V.
To: ASM TECHNOLOGY SINGAPORE PTE. LTD.
Reel/Frame 033127/0396 →
Change of Name Nov 21, 2022
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 061975/0605 →