Patent Assignment
Reel/Frame 033132/0433
Assignment of Assignor's Interest
Recorded: 2014-06-18
Pages: 3
Assignors
SERYOGIN, GEORGIY
Executed: 2014-06-13
GOLOVATO, STEPHEN N.
Executed: 2014-06-12
CHANDRASEKARAN, RAMYA
Executed: 2014-06-13
Assignee
TEL NEXX, INC.
900 MIDDLESEX TURNPIKE, BLDG. 6, BILLERICA, MASSACHUSETTS, 01821
Covered Property
(1)
Method for Increasing Adhesion of Copper to Polymeric Surfaces
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 18, 2014
From: TETREAULT, THOMAS G.
To: TEL EPION INC.
Reel/Frame 033132/0522 →
Assignment of Assignor's Interest
Aug 22, 2018
From: TEL EPION INC.
To: TEL NEXX, INC.
Reel/Frame 046667/0333 →
Change of Name
Jan 14, 2019
From: TEL NEXX, INC.
To: ASM NEXX, INC.
Reel/Frame 048068/0928 →
Change of Name
Nov 21, 2022
From: ASM NEXX INC.
To: ASMPT NEXX, INC.
Reel/Frame 061974/0874 →