IP Library › Assignment 033132/0522
Patent Assignment
Reel/Frame 033132/0522

Assignment of Assignor's Interest

Recorded: 2014-06-18 Pages: 3
Assignor
TETREAULT, THOMAS G.
Executed: 2014-06-10
Assignee
TEL EPION INC.
900 MIDDLESEX TURNPIKE, BLDG. 6, BILLERICA, MASSACHUSETTS, 01821
Covered Property (1)
Method for Increasing Adhesion of Copper to Polymeric Surfaces
Patent: 9,355,864 →
Application: 14/308,420 →
Publication: US 2015/0044871
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 18, 2014
From: SERYOGIN, GEORGIY; GOLOVATO, STEPHEN N.; CHANDRASEKARAN, RAMYA
To: TEL NEXX, INC.
Reel/Frame 033132/0433 →
Assignment of Assignor's Interest Aug 22, 2018
From: TEL EPION INC.
To: TEL NEXX, INC.
Reel/Frame 046667/0333 →
Change of Name Jan 14, 2019
From: TEL NEXX, INC.
To: ASM NEXX, INC.
Reel/Frame 048068/0928 →
Change of Name Nov 21, 2022
From: ASM NEXX INC.
To: ASMPT NEXX, INC.
Reel/Frame 061974/0874 →