IP Library Assignment 033133/0592
Patent Assignment
Reel/Frame 033133/0592

Assignment of Assignor's Interest

Recorded: 2014-06-18 Pages: 5
Assignors
CHUNG, JIN HWA
Executed: 2014-05-27
KWON, KEE HAE
Executed: 2014-05-27
JANG, JOO HYUN
Executed: 2014-05-27
GOO, JA KWAN
Executed: 2014-05-27
PARK, KWANG SOO
Executed: 2014-05-27
Assignee
CHEIL INDUSTRIES INC.
290 GONGDAN-DONG, GUMI-SI, GYEONGSANGBUK-DO, 730-710, KOREA, REPUBLIC OF
Covered Property (1)
Thermoplastic Resin Composition and Molded Products Thereof
Patent: 9,631,087 →
Application: 14/365,091 →
Publication: US 2014/0371375
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jul 8, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039296/0001 →
Assignment of Assignor's Interest Jan 24, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 041062/0242 →