IP Library Assignment 039296/0001
Patent Assignment
Reel/Frame 039296/0001

Merger

Recorded: 2016-07-08 Pages: 15
Assignor
CHEIL INDUSTRIES INC.
Executed: 2014-07-02
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17084, KOREA, REPUBLIC OF
Covered Property (1)
Thermoplastic Resin Composition and Molded Products Thereof
Patent: 9,631,087 →
Application: 14/365,091 →
Publication: US 2014/0371375
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 18, 2014
From: CHUNG, JIN HWA; KWON, KEE HAE; JANG, JOO HYUN; GOO, JA KWAN
To: CHEIL INDUSTRIES INC.
Reel/Frame 033133/0592 →
Assignment of Assignor's Interest Jan 24, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 041062/0242 →