IP Library › Assignment 033149/0422
Patent Assignment
Reel/Frame 033149/0422

Assignment of Assignor's Interest

Recorded: 2014-06-20 Pages: 4
Assignors
ENDO, ARATA
Executed: 2014-06-10
MINEGISHI, SHOJI
Executed: 2014-06-16
ARIMA, MASAO
Executed: 2014-06-16
Assignee
TAIYO INK MFG. CO., LTD.
900, OAZA HIRASAWA, RANZAN-MACHI, HIKI-GUN, SAITAMA, 355-0215, JAPAN
Covered Property (1)
Dry Film, Printed Wiring Board Using Same, Method for Producing Printed Wiring Board, and Flip Chip Mounting Substrate
Patent: 9,596,754 →
Application: 14/367,611 →
Publication: US 2015/0016072
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 20, 2014
From: IWAYAMA, GENTO AS REPRESENTED BY HEIR IWAYAMA, HIROSHI
To: TAIYO INK MFG. CO., LTD.
Reel/Frame 033149/0473 →
Assignment of Assignor's Interest May 8, 2023
From: TAIYO INK MFG. CO., LTD.
To: TAIYO HOLDINGS CO., LTD.
Reel/Frame 063561/0850 →