IP Library › Assignment 033149/0473
Patent Assignment
Reel/Frame 033149/0473

Assignment of Assignor's Interest

Recorded: 2014-06-20 Pages: 3
Assignor
Assignee
TAIYO INK MFG. CO., LTD.
900, OAZA HIRASAWA, RANZAN-MACHI, HIKI-GUN, SAITAMA, 355-0215, JAPAN
Covered Property (1)
Dry Film, Printed Wiring Board Using Same, Method for Producing Printed Wiring Board, and Flip Chip Mounting Substrate
Patent: 9,596,754 →
Application: 14/367,611 →
Publication: US 2015/0016072
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 20, 2014
From: ENDO, ARATA; MINEGISHI, SHOJI; ARIMA, MASAO
To: TAIYO INK MFG. CO., LTD.
Reel/Frame 033149/0422 →
Assignment of Assignor's Interest May 8, 2023
From: TAIYO INK MFG. CO., LTD.
To: TAIYO HOLDINGS CO., LTD.
Reel/Frame 063561/0850 →