Assignment of Assignor's Interest

Recorded: 2014-06-24 Pages: 3

Assignors

ROH, YOUNGDAL

Executed: 2014-06-23

YANG, DEOKKYUNG

Executed: 2014-06-23

LEE, HEESOO

Executed: 2014-06-23

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Integrated Circuit Packaging System with Coreless Substrate and Method of Manufacture Thereof

Patent: 9,171,739 →

Application: 14/313,452 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.