Patent Assignment
Reel/Frame 033197/0973
Assignment of Assignor's Interest
Recorded: 2014-06-27
Pages: 8
Assignors
LEE, JUNEHEE
Executed: 2014-04-15
HYUN, SANGJIN
Executed: 2014-04-07
SONG, JAEYEOL
Executed: 2014-04-29
LEE, HYE-LAN
Executed: 2014-06-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices and Methods of Manufacturing the Same