IP Library › Assignment 033212/0121
Patent Assignment
Reel/Frame 033212/0121

Change of Name

Recorded: 2014-06-30 Pages: 14
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
2-4-8 SHINYOKOHAMA, KOUHOKU-KU, YOKOHAMA, 222-8575, JAPAN
Covered Property (1)
Sealing Apparatus for Semiconductor Wafer, Mold of Sealing Apparatus, and Semiconductor Wafer
Patent: 8,044,507 →
Application: 12/923,303 →
Publication: US 2011/0003026
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2014
From: MATSUMOTO, JIRO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033212/0095 →
Assignment of Assignor's Interest Jul 7, 2014
From: MATSUMOTO, JIRO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033247/0948 →