Assignment of Assignor's Interest

Recorded: 2014-07-07 Pages: 2

Assignor

MATSUMOTO, JIRO

Executed: 2002-04-10

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12 TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Sealing Apparatus for Semiconductor Wafer, Mold of Sealing Apparatus, and Semiconductor Wafer

Patent: 8,044,507 →

Application: 12/923,303 →

Publication: US 2011/0003026

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.