IP Library › Assignment 033234/0902
Patent Assignment
Reel/Frame 033234/0902

Assignment of Assignor's Interest

Recorded: 2014-07-02 Pages: 2
Assignors
ISRAEL, EMIL CASEY
Executed: 2014-06-27
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property (1)
Exposed Die Clip Bond Power Package
Patent: 9,263,299 →
Application: 14/322,656 →
Publication: US 2016/0005626
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2024
From: NXP B.V.
To: CHIP PACKAGING TECHNOLOGIES, LLC
Reel/Frame 068542/0027 →