IP Library › Assignment 068542/0027
Patent Assignment
Reel/Frame 068542/0027

Assignment of Assignor's Interest

Recorded: 2024-09-10 Pages: 9
Assignor
NXP B.V.
Executed: 2024-07-31
Assignee
CHIP PACKAGING TECHNOLOGIES, LLC
5830 GRANITE PARKWAY, SUITE #100-216, PLANO, TEXAS, 75024
Covered Properties (9)
Wire-Bonded Semiconductor Component with Reinforced Inner Connection Metallization
Patent: 8,013,452 →
Application: 10/581,162 →
Publication: US 2008/0230920
Leadframe Structure for Electronic Packages
Patent: 8,258,611 →
Application: 12/669,338 →
Publication: US 2010/0200973
Esd Networks for Solder Bump Integrated Circuits
Patent: 8,427,797 →
Application: 12/933,786 →
Publication: US 2011/0019320
Integrated Circuit and Method of Manufacturing the Same
Patent: 8,895,357 →
Application: 13/857,091 →
Publication: US 2013/0264691
Exposed Die Clip Bond Power Package
Patent: 9,263,299 →
Application: 14/322,656 →
Publication: US 2016/0005626
Integrated Circuit and Method of Manufacturing the Same
Application: 14/514,619 →
Publication: US 2015/0069587
Shielded Qfn Package and Method of Making
Patent: 9,653,414 →
Application: 14/806,486 →
Publication: US 2017/0025369
Shielded Qfn Package and Method of Making
Application: 15/464,016 →
Publication: US 2017/0213797
Multi-Via Redistribution Layer for Integrated Circuits Having Solder Balls
Application: 15/849,656 →
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest Jan 15, 2010
From: SCHRAVENDEEL, RONALD; SCHELWALD, PETER
To: NXP B.V.
Reel/Frame 023797/0766 →
Assignment of Assignor's Interest Sep 21, 2010
From: CHARLON, OLIVIER; AKYLAS, VICTOR
To: NXP B.V.
Reel/Frame 025021/0842 →
Assignment of Assignor's Interest Apr 4, 2013
From: KAMPHUIS, TONNY; VAN GEMERT, LEONARDUS ANTONIUS ELISABETH; BEELEN-HENDRIKX, CAROLINE CATHARINA MARIA
To: NXP B.V.
Reel/Frame 030155/0646 →
Assignment of Assignor's Interest Jul 2, 2014
From: VAN GEMERT, LEONARDUS ANTONIUS ELISABETH; ISRAEL, EMIL CASEY
To: NXP B.V.
Reel/Frame 033234/0902 →
Assignment of Assignor's Interest Oct 15, 2014
From: KAMPHUIS, TONNY; VAN GEMERT, LEONARDUS ANTONIUS ELISABETH; BEELEN-HENDRIKX, CAROLINE CATHARINA MARIA
To: NXP B.V.
Reel/Frame 033952/0468 →
Assignment of Assignor's Interest Jul 22, 2015
From: GULPEN, JAN; VAN GEMERT, LEONARDUS ANTONIUS ELISABETH
To: NXP B.V.
Reel/Frame 036157/0495 →
Security Agreement Supplement Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Assignment of Assignor's Interest Oct 2, 2017
From: BEHRENS, JORG
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 043750/0077 →
Assignment of Assignor's Interest Dec 20, 2017
From: HO, CHUNG HSIUNG; HSIAO, WAYNE; GAN, RICHARD TE; SPEHAR, JAMES RAYMOND
To: NXP B.V.
Reel/Frame 044455/0088 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042762 Frame 0145. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042985 Frame 0001. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →