Assignment of Assignor's Interest

Recorded: 2017-12-20 Pages: 2

Assignors

HO, CHUNG HSIUNG

Executed: 2017-12-20

HSIAO, WAYNE

Executed: 2017-12-20

GAN, RICHARD TE

Executed: 2017-12-20

SPEHAR, JAMES RAYMOND

Executed: 2017-12-20

Assignee

NXP B.V.

411 EAST PLUMERIA DRIVE, MS41, SAN JOSE, CALIFORNIA, 95134

Covered Property (1)

Multi-Via Redistribution Layer for Integrated Circuits Having Solder Balls

Patent: 10,192,837 →

Application: 15/849,656 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.