Patent Assignment
Reel/Frame 033268/0188
Assignment of Assignor's Interest
Recorded: 2014-07-09
Pages: 6
Assignors
MOON, KWANG-JIN
Executed: 2014-07-03
PARK, BYUNG-LYUL
Executed: 2014-07-03
PARK, JAE-HWA
Executed: 2014-07-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Integrated Circuit, Method for Fabricating the Same, and Semiconductor Package