Patent Assignment
Reel/Frame 033287/0830
Assignment of Assignor's Interest
Recorded: 2014-07-10
Pages: 6
Assignors
MITARAI, SHUN
Executed: 2014-06-12
YANAGAWA, SHUSAKU
Executed: 2014-06-13
ROKUHARA, SHINJI
Executed: 2014-06-13
OKA, SHUICHI
Executed: 2014-06-13
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Wiring Substrate, Method of Manufacturing Wiring Substrate, Component-Embedded Glass Substrate, and Method of Manufacturing Component-Embedded Glass Substrate