Patent Assignment
Reel/Frame 033291/0734
Assignment of Assignor's Interest
Recorded: 2014-07-11
Pages: 5
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Fabricating Interlayer Dielectric Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.