IP Library › Assignment 033292/0265
Patent Assignment
Reel/Frame 033292/0265

Assignment of Assignor's Interest

Recorded: 2014-07-11 Pages: 3
Assignors
CHENG, CHUNG-LIANG
Executed: 2014-06-04
CHEN, YEN-YU
Executed: 2014-06-04
LEE, CHANG-SHENG
Executed: 2014-06-04
ZHANG, WEI
Executed: 2014-06-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property (1)
Planarization Method, Method for Polishing Wafer, and Cmp System
Patent: 9,425,109 →
Application: 14/292,162 →
Publication: US 2015/0348856
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 5, 2015
From: BANDE, PANKAJ SURESH; RAJU, BITTU ABY; MOHAN, MIDHUN
To: WIPRO LIMITED
Reel/Frame 036972/0786 →