IP Library › Assignment 036972/0786
Patent Assignment
Reel/Frame 036972/0786

Assignment of Assignor's Interest

Recorded: 2015-11-05 Pages: 4
Assignors
BANDE, PANKAJ SURESH
Executed: 2015-08-07
RAJU, BITTU ABY
Executed: 2015-08-07
MOHAN, MIDHUN
Executed: 2015-08-07
Assignee
WIPRO LIMITED
DODDAKANNELLI, SARJAPUR ROAD, BANGALORE, 560 035, INDIA
Covered Property (1)
Planarization Method, Method for Polishing Wafer, and Cmp System
Patent: 9,425,109 →
Application: 14/292,162 →
Publication: US 2015/0348856
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2014
From: CHENG, CHUNG-LIANG; CHEN, YEN-YU; LEE, CHANG-SHENG; ZHANG, WEI
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 033292/0265 →