Patent Assignment
Reel/Frame 033298/0105
Assignment of Assignor's Interest
Recorded: 2014-07-11
Pages: 7
Assignors
YOKOYAMA, OSAMU
Executed: 2014-06-13
HAN, CHEONSOO
Executed: 2014-06-16
SAKUMA, TAKASHI
Executed: 2014-07-07
YASUMURO, CHIAKI
Executed: 2014-06-13
HIRASAWA, TATSUO
Executed: 2014-06-13
ISHIZAKA, TADAHIRO
Executed: 2014-06-13
SUZUKI, KENJI
Executed: 2014-06-13
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Copper Wiring Forming Method with Ru Liner and Cu Alloy Fill