Patent Assignment
Reel/Frame 033306/0413
Assignment of Assignor's Interest
Recorded: 2014-07-14
Pages: 2
Assignors
CHUANG, CHIANG-MING
Executed: 2012-01-03
HUANG, CHUN CHE
Executed: 2012-01-10
CHANG, SHIH-CHIEH
Executed: 2012-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Making Bond Pad