Patent Assignment
Reel/Frame 033325/0563
Assignment of Assignor's Interest
Recorded: 2014-07-16
Pages: 2
Assignors
TANAKA, TAKAAKI
Executed: 2009-10-15
FUKUSAWA, MASATO
Executed: 2009-10-07
NOBE, SHIGERU
Executed: 2009-10-07
SAKURADA, TAKAFUMI
Executed: 2009-10-13
SHINODA, TAKASHI
Executed: 2009-10-07
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Polishing Slurry for Metal Films and Polishing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Sep 12, 2014
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 033728/0128 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →