IP Library Assignment 033728/0128
Patent Assignment
Reel/Frame 033728/0128

Change of Address

Recorded: 2014-09-12 Pages: 6
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-22
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Polishing Slurry for Metal Films and Polishing Method
Patent: 8,901,002 →
Application: 14/079,152 →
Publication: US 2014/0065826
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 16, 2014
From: TANAKA, TAKAAKI; FUKUSAWA, MASATO; NOBE, SHIGERU; SAKURADA, TAKAFUMI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 033325/0563 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →