Patent Assignment
Reel/Frame 033364/0730
Assignment of Assignor's Interest
Recorded: 2014-07-22
Pages: 3
Assignors
FAVENNEC, LAURENT
Executed: 2014-02-20
TOURNIER, ARNAUD
Executed: 2014-02-17
ROY, FRANCOIS
Executed: 2014-02-17
Assignee
STMICROELECTRONICS (CROLLES 2) SAS
850, RUE JEAN MONNET, CROLLES, 38926, FRANCE
Covered Property
(1)
Method for Forming an Insulating Trench in a Semiconductor Substrate and Structure, Especially Cmos Image Sensor, Obtained by Said Method