Patent Assignment
Reel/Frame 033365/0913
Assignment of Assignor's Interest
Recorded: 2014-07-22
Pages: 2
Assignor
OH, TAC KEUN
Executed: 2014-07-16
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Semiconductor Stack Packages