Patent Assignment
Reel/Frame 033378/0598
Security Interest
Recorded: 2014-07-22
Pages: 10
Assignor
REVERA INCORPORATED
Executed: 2010-04-27
Assignee
SILICON VALLEY BANK
3003 TASMAN DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(4)
Semiconductor Substrate Processing Method and Apparatus
Method and System for Non-Destructive Distribution Profiling of an Element in a Film
Method and Discovery System for Discovering Encrypted Peer-to-Peer (EP2P) Nodes Associated with a Particular EP2P Network
Patent:
8,510,548 →
Application:
13/244,084 →
Method and System for Non-Destructive Distribution Profiling of an Element in a Film
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
Apr 3, 2015
From: SILICON VALLEY BANK
To: REVERA INCORPORATED
Reel/Frame 035333/0150 →
Merger
Jan 23, 2018
From: REVERA INCORPORATED
To: NOVA MEASURING INSTRUMENTS INC.
Reel/Frame 044706/0656 →
Merger
Feb 21, 2018
From: REVERA INCORPORATED
To: NOVA MEASURING INSTRUMENTS INC.
Reel/Frame 044990/0829 →