Patent Assignment
Reel/Frame 033393/0414
Assignment of Assignor's Interest
Recorded: 2014-07-25
Pages: 2
Assignors
HWANG, CHIEN LING
Executed: 2011-02-08
LIM, ZHENG-YI
Executed: 2011-02-10
LIU, CHUNG-SHI
Executed: 2011-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Copper Pillar Bump with Cobalt-Containing Sidewall Protection Layer