Assignment of Assignor's Interest

Recorded: 2014-07-29 Pages: 2

Assignors

XIANG, HUA

Executed: 2014-07-24

FU, QIAN

Executed: 2014-07-23

Assignee

LAM RESEARCH CORPORATION

4650 CUSHING PARKWAY, FREMONT, CALIFORNIA, 94538

Covered Property (1)

Method to Etch a Tungsten Containing Layer

Patent: 9,418,869 →

Application: 14/445,975 →

Publication: US 2016/0035585