Patent Assignment
Reel/Frame 033482/0338
Assignment of Assignor's Interest
Recorded: 2014-08-06
Pages: 12
Assignors
AHN, SEO YEON
Executed: 2014-08-04
SUNG, PIL JE
Executed: 2014-08-06
PARK, DOO HYUN
Executed: 2014-08-06
PAEK, JONG SIK
Executed: 2014-08-01
KIM, YOUNG RAE
Executed: 2014-08-01
KIM, HUI TAE
Executed: 2014-08-06
SONG, YONG
Executed: 2014-08-06
YUN, SEOK WOO
Executed: 2014-08-06
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Semiconductor Package with Reduced Thickness
Application:
14/452,933 →
Publication:
US 2015/0041980
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →