IP Library › Assignment 033495/0615
Patent Assignment
Reel/Frame 033495/0615

Assignment of Assignor's Interest

Recorded: 2014-08-08 Pages: 5
Assignors
LEE, DONG HOON
Executed: 2014-07-04
KIM, DO HYUNG
Executed: 2014-07-02
HAN, SEUNG CHUL
Executed: 2014-07-04
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property (1)
Semiconductor Device with Thin Redistribution Layers
Patent: 9,607,919 →
Application: 14/444,450 →
Publication: US 2015/0255361
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 28, 2014
From: LEE, DONG HOON; KIM, DO HYUNG; HAN, SEUNG CHUL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 033403/0765 →
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →